Aavid, Thermal Division of Boyd Corporation - 2292BG

KEY Part #: K6234775

2292BG Pagpepresyo (USD) [19414pcs Stock]

  • 1 pcs$2.15687
  • 5,000 pcs$2.14614

Bilang ng Bahagi:
2292BG
Tagagawa:
Aavid, Thermal Division of Boyd Corporation
Detalyadong Paglalarawan:
BOARD LEVEL HEAT SINK. Heat Sinks Board Level Extruded Heatsink for Leadless Chip Carriers, Flat Packs and 68 Position, Radial Fin Round, Horizontal/Vertical Mounting, 28.58x28.58x9.14mm
Manufacturer's standard lead time:
Sa stock
Buhay sa istante:
Isang taon
Chip Mula:
Hong Kong
RoHS:
Paraan ng Pagbayad:
Paraan ng pagpapadala:
Mga Kategorya ng Pamilya:
Ang KEY Components Co, LTD ay isang Electronic Components Distributor na nag-aalok ng mga kategorya ng produkto kasama ang: Thermal - Pagpapalamig ng Liquid, Thermal - Thermoelectric, Peltier Modules, Thermal - Pagpili, Epoxies, Greases, Pastes, Mga Tagahanga ng AC, Mga Tagahanga - Mga Kagamitan - Fan Cords, Mga Tagahanga - Mga Kagamitan, Mga Tagahanga ng DC and Thermal - Init na Pipa, Mga silid na singaw ...
Kumpetensyang Pakinabang:
We specialize in Aavid, Thermal Division of Boyd Corporation 2292BG electronic components. 2292BG can be shipped within 24 hours after order. If you have any demands for 2292BG, Please submit a Request for Quotation here or send us an email:
GB-T-27922
ISO-9001-2015
ISO-13485
ISO-14001
ISO-28000-2007
ISO-45001-2018

2292BG Mga katangian ng produkto

Bilang ng Bahagi : 2292BG
Tagagawa : Aavid, Thermal Division of Boyd Corporation
Paglalarawan : BOARD LEVEL HEAT SINK
Serye : -
Katayuan ng Bahagi : Active
Uri : Board Level
Pinalamig ang Pakete : BGA
Paraan ng Lakip : Thermal Tape, Adhesive (Not Included)
Hugis : Cylindrical
Haba : -
Lapad : -
Diameter : 0.300" (7.62mm) ID, 1.125" (28.57mm) OD
Taas ng Base (Taas ng Fin) : -
Power Dissipation @ temperatura ng Pagtaas : 1.5W @ 40°C
Thermal Resistance @ Sapilitang Air Flow : 8.00°C/W @ 400 LFM
Thermal Resistance @ Likas : -
Materyal : Aluminum
Tapos na ang Materyal : Black Anodized

Maaari ka ring Makisalamuha sa
  • 511-3M

    Wakefield-Vette

    HEATSINK FOR PWR MOD/IGBT/RELAY. Heat Sinks High Fin Density Heatsinks for Power Modules, IGBTs, Relays, Milled Base, 132.33x76.2mm

  • 1-1542002-1

    TE Connectivity AMP Connectors

    HEAT SINK BGA 37.5MM 2FIN RADIAL. Heat Sinks 2 Fin Radial 37.5 x 37.5

  • C264-085-3VE

    Ohmite

    HEATSINK AND CLIPS FOR 3 TO-264. Heat Sinks HEATSINK FOR TO-264 3 CLIPS, NO FINISH

  • TXP1808B

    CTS Thermal Management Products

    THERMAL LINK PRESS ON BLACK TO-1. Heat Sinks THERMAL LINK PRESS ON BLK

  • TXBE032031B

    CTS Thermal Management Products

    HEATSINK PRESS ON BLACK TO-5. Heat Sinks TO-5 Solder Glue Adhesive mt.

  • 7-175-BA

    CTS Thermal Management Products

    HEATSINK PRESS ON .25H BLK TO-5.