[8725pcs Stock]
- Bilang ng Bahagi:
- APF19-19-13CB
- Tagagawa:
- CTS Thermal Management Products
- Detalyadong Paglalarawan:
- HEATSINK LOW-PROFILE FORGED.
- Manufacturer's standard lead time:
- Sa stock
- Buhay sa istante:
- Isang taon
- Chip Mula:
- Hong Kong
- RoHS:
- Paraan ng Pagbayad:
-
- Paraan ng pagpapadala:
- Mga Kategorya ng Pamilya:
- Ang KEY Components Co, LTD ay isang Electronic Components Distributor na nag-aalok ng mga kategorya ng produkto kasama ang: Thermal - Pagpili, Epoxies, Greases, Pastes, Mga Tagahanga - Mga Kagamitan, Mga Tagahanga - Mga Kagamitan - Fan Cords, Mga Tagahanga ng AC, Thermal - Sobrang init, Thermal - Mga Pads, Sheet, Thermal - Mga Kagamitan and Thermal - Pagpili, Epoxies, Greases, Pastes ...
- Kumpetensyang Pakinabang:
- We specialize in CTS Thermal Management Products APF19-19-13CB electronic components. APF19-19-13CB can be shipped within 24 hours after order. If you have any demands for APF19-19-13CB, Please submit a Request for Quotation here or send us an email: rfq@key-components.com
APF19-19-13CB Mga katangian ng produkto
Bilang ng Bahagi :
APF19-19-13CB
Tagagawa :
CTS Thermal Management Products
Paglalarawan :
HEATSINK LOW-PROFILE FORGED
Serye :
APF
Katayuan ng Bahagi :
Active
Uri :
Top Mount
Pinalamig ang Pakete :
Assorted (BGA, LGA, CPU, ASIC...)
Paraan ng Lakip :
Thermal Tape, Adhesive (Not Included)
Hugis :
Square, Fins
Haba :
0.748" (19.00mm)
Lapad :
0.748" (19.00mm)
Diameter :
-
Taas ng Base (Taas ng Fin) :
0.500" (12.70mm)
Power Dissipation @ temperatura ng Pagtaas :
-
Thermal Resistance @ Sapilitang Air Flow :
4.00°C/W @ 200 LFM
Thermal Resistance @ Likas :
-
Materyal :
Aluminum
Tapos na ang Materyal :
Black Anodized
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