Bergquist - GPHC3.0-0.125-02-0816

KEY Part #: K6153034

GPHC3.0-0.125-02-0816 Pagpepresyo (USD) [602pcs Stock]

  • 1 pcs$77.50963
  • 3 pcs$77.12401

Bilang ng Bahagi:
GPHC3.0-0.125-02-0816
Tagagawa:
Bergquist
Detalyadong Paglalarawan:
THERM PAD 406.4MMX203.2MM BLUE. Thermal Interface Products BERGQUIST GAP PAD TGP HC3000
Manufacturer's standard lead time:
Sa stock
Buhay sa istante:
Isang taon
Chip Mula:
Hong Kong
RoHS:
Paraan ng Pagbayad:
Paraan ng pagpapadala:
Mga Kategorya ng Pamilya:
Ang KEY Components Co, LTD ay isang Electronic Components Distributor na nag-aalok ng mga kategorya ng produkto kasama ang: Thermal - Thermoelectric, Peltier Assemblies, Thermal - Sobrang init, Mga Tagahanga ng DC, Thermal - Pagpili, Epoxies, Greases, Pastes, Thermal - Init na Pipa, Mga silid na singaw, Mga Tagahanga - Mga Kagamitan - Fan Cords, Mga Tagahanga ng AC and Thermal - Pagpapalamig ng Liquid ...
Kumpetensyang Pakinabang:
We specialize in Bergquist GPHC3.0-0.125-02-0816 electronic components. GPHC3.0-0.125-02-0816 can be shipped within 24 hours after order. If you have any demands for GPHC3.0-0.125-02-0816, Please submit a Request for Quotation here or send us an email:
GB-T-27922
ISO-9001-2015
ISO-13485
ISO-14001
ISO-28000-2007
ISO-45001-2018

GPHC3.0-0.125-02-0816 Mga katangian ng produkto

Bilang ng Bahagi : GPHC3.0-0.125-02-0816
Tagagawa : Bergquist
Paglalarawan : THERM PAD 406.4MMX203.2MM BLUE
Serye : Gap Pad® HC 3.0
Katayuan ng Bahagi : Active
Paggamit : -
Uri : Pad, Sheet
Hugis : Rectangular
Balangkas : 406.40mm x 203.20mm
Kapal : 0.125" (3.18mm)
Materyal : -
Malagkit : Tacky - Both Sides
Pag-back, Carrier : Fiberglass
Kulay : Blue
Thermal Resistivity : -
Pag-andar ng Thermal : 3.0 W/m-K

Maaari ka ring Makisalamuha sa
  • PL-2-3-254

    Wakefield-Vette

    THERM PAD 25.4MMX25.4MM GREEN. Thermal Interface Products ulTIMiFlux Thermal Gap Filling Pad, 3 W/m K Silicone Gap Filler, 2.0mm Thickness, 25.4x25.4mm, Green

  • CD-02-05-C-18

    Wakefield-Vette

    THERM PAD 0.689 X 0.689. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, Chipset Pad 0.689 Inch x 0.689 Inch, No Hole

  • CD-02-05-220

    Wakefield-Vette

    THERM PAD 17.78MMX12.7MM ORANGE. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, TO-220 Pad, 0.003 Inch Thick

  • CD-02-05-220-N

    Wakefield-Vette

    THERM PAD TO-220 NO HOLE. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, TO-220 Pad, No Hole

  • CD-02-05-C-34

    Wakefield-Vette

    THERM PAD 1.319 X 1.319. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, Chipset Pad 1.319 Inch x 1.319 Inch, No Hole

  • CD-02-05-247-N

    Wakefield-Vette

    THERM PAD TO-247 NO HOLE. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, TO-247 Pad, No Hole