BGM13HBA9E6327XTSA1 Pagpepresyo (USD) [321466pcs Stock]
- 1 pcs$0.11563
- 4,500 pcs$0.11506
- Bilang ng Bahagi:
- BGM13HBA9E6327XTSA1
- Tagagawa:
- Infineon Technologies
- Detalyadong Paglalarawan:
- MULTI CHIP MODULES.
- Manufacturer's standard lead time:
- Sa stock
- Buhay sa istante:
- Isang taon
- Chip Mula:
- Hong Kong
- RoHS:
- Paraan ng Pagbayad:
-
- Paraan ng pagpapadala:
- Mga Kategorya ng Pamilya:
- Ang KEY Components Co, LTD ay isang Electronic Components Distributor na nag-aalok ng mga kategorya ng produkto kasama ang: Balun, RF Modulators, Mga RF Shields, RFID Evaluation and Development Kits, Mga Board, Mga Rf Mixer, RF Directional Coupler, Mga Rf Receiver and RF Diplexers ...
- Kumpetensyang Pakinabang:
- We specialize in Infineon Technologies BGM13HBA9E6327XTSA1 electronic components. BGM13HBA9E6327XTSA1 can be shipped within 24 hours after order. If you have any demands for BGM13HBA9E6327XTSA1, Please submit a Request for Quotation here or send us an email: rfq@key-components.com
BGM13HBA9E6327XTSA1 Mga katangian ng produkto
Bilang ng Bahagi :
BGM13HBA9E6327XTSA1
Tagagawa :
Infineon Technologies
Paglalarawan :
MULTI CHIP MODULES
Serye :
-
Katayuan ng Bahagi :
Active
Pamilya / Pamantayang RF :
Bluetooth
Protocol :
802.11a/b/g/n, Bluetooth v4.0
Modulasyon :
16QAM, 64QAM, 256QAM, DSSS, FHSS, OFDM
Dalas :
1.805GHz ~ 2.69GHz
Rate ng data :
54Mbps
Kapangyarihan - Output :
-
Pagkamapagdamdam :
-
Mga Serial Interfaces :
SPI, USB
Uri ng Antena :
-
Gamit ang IC / Bahagi :
-
Laki ng memorya :
-
Boltahe - Supply :
1.6V ~ 3.1V
Kasalukuyang - Tumatanggap :
-
Kasalukuyang - Paglilipat :
-
Uri ng Pag-mount :
Surface Mount
Temperatura ng pagpapatakbo :
-40°C ~ 85°C
Pakete / Kaso :
-
Pinakabagong Balita
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