t-Global Technology - PC93-24-21.01-3

KEY Part #: K6153185

PC93-24-21.01-3 Pagpepresyo (USD) [83500pcs Stock]

  • 1 pcs$0.46827
  • 10 pcs$0.44611
  • 25 pcs$0.43432
  • 50 pcs$0.42262
  • 100 pcs$0.39916
  • 250 pcs$0.37569
  • 500 pcs$0.33317
  • 1,000 pcs$0.31096
  • 5,000 pcs$0.29985

Bilang ng Bahagi:
PC93-24-21.01-3
Tagagawa:
t-Global Technology
Detalyadong Paglalarawan:
THERM PAD 24MMX21.01MM GRAY.
Manufacturer's standard lead time:
Sa stock
Buhay sa istante:
Isang taon
Chip Mula:
Hong Kong
RoHS:
Paraan ng Pagbayad:
Paraan ng pagpapadala:
Mga Kategorya ng Pamilya:
Ang KEY Components Co, LTD ay isang Electronic Components Distributor na nag-aalok ng mga kategorya ng produkto kasama ang: Thermal - Mga Pads, Sheet, Thermal - Mga Kagamitan, Thermal - Pagpili, Epoxies, Greases, Pastes, Thermal - Pagpili, Epoxies, Greases, Pastes, Mga Tagahanga ng AC, Thermal - Pagpapalamig ng Liquid, Mga Tagahanga ng DC and Thermal - Thermoelectric, Peltier Assemblies ...
Kumpetensyang Pakinabang:
We specialize in t-Global Technology PC93-24-21.01-3 electronic components. PC93-24-21.01-3 can be shipped within 24 hours after order. If you have any demands for PC93-24-21.01-3, Please submit a Request for Quotation here or send us an email:
GB-T-27922
ISO-9001-2015
ISO-13485
ISO-14001
ISO-28000-2007
ISO-45001-2018

PC93-24-21.01-3 Mga katangian ng produkto

Bilang ng Bahagi : PC93-24-21.01-3
Tagagawa : t-Global Technology
Paglalarawan : THERM PAD 24MMX21.01MM GRAY
Serye : PC93
Katayuan ng Bahagi : Active
Paggamit : -
Uri : Conductive Pad, Sheet
Hugis : Rectangular
Balangkas : 24.00mm x 21.01mm
Kapal : 0.118" (3.00mm)
Materyal : Non-Silicone
Malagkit : -
Pag-back, Carrier : -
Kulay : Gray
Thermal Resistivity : -
Pag-andar ng Thermal : 2.0 W/m-K

Maaari ka ring Makisalamuha sa
  • PL-2-1-254

    Wakefield-Vette

    THERM PAD 25.4MMX25.4MM GRAY. Thermal Interface Products ulTIMiFlux Thermal Gap Filling Pad, 1 W/m K Silicone Gap Filler, 2.0mm Thickness, 25.4x25.4mm, Grey

  • CD-02-05-C-18

    Wakefield-Vette

    THERM PAD 0.689 X 0.689. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, Chipset Pad 0.689 Inch x 0.689 Inch, No Hole

  • CD-02-05-126

    Wakefield-Vette

    THERM PAD TO-126 PAD WITH HOLE. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, TO-126 Pad with Hole

  • CD-02-05-C-20

    Wakefield-Vette

    THERM PAD 0.768 X 0.768. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, Chipset Pad 0.768 Inch x 0.768 Inch, No Hole

  • CD-02-05-REC-125-N

    Wakefield-Vette

    THERM PAD RECT 1.25 X 1.25. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, Rectifier Pad 1.25 Inch x 1.25 Inch, No Hole

  • PL-2-5-254-H

    Wakefield-Vette

    THERM PAD 25.4MMX25.4MM GOLD. Thermal Interface Products ulTIMiFlux Thermal Gap Filling Pad, 5 W/m K Silicone Gap Filler, 2.0mm Thickness, 25.4x25.4mm, Gold, Hyper Soft