Laird Technologies - Thermal Materials - A15896-07

KEY Part #: K6153081

A15896-07 Pagpepresyo (USD) [687pcs Stock]

  • 1 pcs$67.98062
  • 3 pcs$67.64240

Bilang ng Bahagi:
A15896-07
Tagagawa:
Laird Technologies - Thermal Materials
Detalyadong Paglalarawan:
THERM PAD 228.6MMX228.6MM GRAY. Thermal Interface Products Tflex 770 9" x 9"
Manufacturer's standard lead time:
Sa stock
Buhay sa istante:
Isang taon
Chip Mula:
Hong Kong
RoHS:
Paraan ng Pagbayad:
Paraan ng pagpapadala:
Mga Kategorya ng Pamilya:
Ang KEY Components Co, LTD ay isang Electronic Components Distributor na nag-aalok ng mga kategorya ng produkto kasama ang: Mga Tagahanga - Mga Kagamitan, Thermal - Init na Pipa, Mga silid na singaw, Mga Tagahanga ng AC, Thermal - Mga Pads, Sheet, Thermal - Pagpili, Epoxies, Greases, Pastes, Thermal - Thermoelectric, Peltier Modules, Thermal - Sobrang init and Thermal - Mga Kagamitan ...
Kumpetensyang Pakinabang:
We specialize in Laird Technologies - Thermal Materials A15896-07 electronic components. A15896-07 can be shipped within 24 hours after order. If you have any demands for A15896-07, Please submit a Request for Quotation here or send us an email:
GB-T-27922
ISO-9001-2015
ISO-13485
ISO-14001
ISO-28000-2007
ISO-45001-2018

A15896-07 Mga katangian ng produkto

Bilang ng Bahagi : A15896-07
Tagagawa : Laird Technologies - Thermal Materials
Paglalarawan : THERM PAD 228.6MMX228.6MM GRAY
Serye : Tflex™ 700
Katayuan ng Bahagi : Not For New Designs
Paggamit : -
Uri : Gap Filler Pad, Sheet
Hugis : Square
Balangkas : 228.60mm x 228.60mm
Kapal : 0.0700" (1.778mm)
Materyal : Silicone
Malagkit : Tacky - Both Sides
Pag-back, Carrier : -
Kulay : Gray
Thermal Resistivity : -
Pag-andar ng Thermal : 5.0 W/m-K

Maaari ka ring Makisalamuha sa
  • PL-2-3-254

    Wakefield-Vette

    THERM PAD 25.4MMX25.4MM GREEN. Thermal Interface Products ulTIMiFlux Thermal Gap Filling Pad, 3 W/m K Silicone Gap Filler, 2.0mm Thickness, 25.4x25.4mm, Green

  • CD-02-05-C-18

    Wakefield-Vette

    THERM PAD 0.689 X 0.689. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, Chipset Pad 0.689 Inch x 0.689 Inch, No Hole

  • CD-02-05-220

    Wakefield-Vette

    THERM PAD 17.78MMX12.7MM ORANGE. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, TO-220 Pad, 0.003 Inch Thick

  • CD-02-05-220-N

    Wakefield-Vette

    THERM PAD TO-220 NO HOLE. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, TO-220 Pad, No Hole

  • CD-02-05-247-N

    Wakefield-Vette

    THERM PAD TO-247 NO HOLE. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, TO-247 Pad, No Hole

  • CD-02-05-025

    Wakefield-Vette

    THERM PAD 25.4MMX25.4MM ORANGE. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, 1 Inch x 1 Inch Square Pad, 0.003 Inch Thick