Laird Technologies - Thermal Materials - A15996-05

KEY Part #: K6153169

A15996-05 Pagpepresyo (USD) [830pcs Stock]

  • 1 pcs$56.16471
  • 4 pcs$55.88528

Bilang ng Bahagi:
A15996-05
Tagagawa:
Laird Technologies - Thermal Materials
Detalyadong Paglalarawan:
THERM PAD 228.6MMX228.6MM GRAY.
Manufacturer's standard lead time:
Sa stock
Buhay sa istante:
Isang taon
Chip Mula:
Hong Kong
RoHS:
Paraan ng Pagbayad:
Paraan ng pagpapadala:
Mga Kategorya ng Pamilya:
Ang KEY Components Co, LTD ay isang Electronic Components Distributor na nag-aalok ng mga kategorya ng produkto kasama ang: Thermal - Pagpapalamig ng Liquid, Thermal - Pagpili, Epoxies, Greases, Pastes, Thermal - Thermoelectric, Peltier Modules, Mga Tagahanga - Mga Kagamitan, Thermal - Sobrang init, Thermal - Init na Pipa, Mga silid na singaw, Mga Tagahanga ng DC and Mga Tagahanga ng AC ...
Kumpetensyang Pakinabang:
We specialize in Laird Technologies - Thermal Materials A15996-05 electronic components. A15996-05 can be shipped within 24 hours after order. If you have any demands for A15996-05, Please submit a Request for Quotation here or send us an email:
GB-T-27922
ISO-9001-2015
ISO-13485
ISO-14001
ISO-28000-2007
ISO-45001-2018

A15996-05 Mga katangian ng produkto

Bilang ng Bahagi : A15996-05
Tagagawa : Laird Technologies - Thermal Materials
Paglalarawan : THERM PAD 228.6MMX228.6MM GRAY
Serye : Tflex™ 700
Katayuan ng Bahagi : Not For New Designs
Paggamit : -
Uri : Gap Filler Pad, Sheet
Hugis : Square
Balangkas : 228.60mm x 228.60mm
Kapal : 0.0500" (1.270mm)
Materyal : Silicone
Malagkit : Tacky - One Side
Pag-back, Carrier : -
Kulay : Gray
Thermal Resistivity : -
Pag-andar ng Thermal : 5.0 W/m-K

Maaari ka ring Makisalamuha sa
  • PL-2-1-254

    Wakefield-Vette

    THERM PAD 25.4MMX25.4MM GRAY. Thermal Interface Products ulTIMiFlux Thermal Gap Filling Pad, 1 W/m K Silicone Gap Filler, 2.0mm Thickness, 25.4x25.4mm, Grey

  • CD-02-05-C-18

    Wakefield-Vette

    THERM PAD 0.689 X 0.689. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, Chipset Pad 0.689 Inch x 0.689 Inch, No Hole

  • CD-02-05-126

    Wakefield-Vette

    THERM PAD TO-126 PAD WITH HOLE. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, TO-126 Pad with Hole

  • CD-02-05-C-20

    Wakefield-Vette

    THERM PAD 0.768 X 0.768. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, Chipset Pad 0.768 Inch x 0.768 Inch, No Hole

  • CD-02-05-REC-125-N

    Wakefield-Vette

    THERM PAD RECT 1.25 X 1.25. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, Rectifier Pad 1.25 Inch x 1.25 Inch, No Hole

  • PL-2-5-254-H

    Wakefield-Vette

    THERM PAD 25.4MMX25.4MM GOLD. Thermal Interface Products ulTIMiFlux Thermal Gap Filling Pad, 5 W/m K Silicone Gap Filler, 2.0mm Thickness, 25.4x25.4mm, Gold, Hyper Soft