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BDN13-3CB/A01 Mga katangian ng produkto
Bilang ng Bahagi :BDN13-3CB/A01
Tagagawa :CTS Thermal Management Products
Paglalarawan :HEATSINK CPU W/ADHESIVE 1.31SQ
Serye :BDN
Katayuan ng Bahagi :Active
Uri :Top Mount
Pinalamig ang Pakete :Assorted (BGA, LGA, CPU, ASIC...)
Paraan ng Lakip :Thermal Tape, Adhesive (Included)
Hugis :Square, Pin Fins
Haba :1.310" (33.27mm)
Lapad :1.310" (33.27mm)
Diameter :-
Taas ng Base (Taas ng Fin) :0.355" (9.02mm)
Power Dissipation @ temperatura ng Pagtaas :-
Thermal Resistance @ Sapilitang Air Flow :6.00°C/W @ 400 LFM