BDN09-3CB/A01 Pagpepresyo (USD) [35025pcs Stock]
- 1 pcs$0.98254
- 10 pcs$0.95745
- 25 pcs$0.93169
- 50 pcs$0.87993
- 100 pcs$0.82817
- 250 pcs$0.77641
- 500 pcs$0.75053
- 1,000 pcs$0.67289
- 5,000 pcs$0.65995
- Bilang ng Bahagi:
- BDN09-3CB/A01
- Tagagawa:
- CTS Thermal Management Products
- Detalyadong Paglalarawan:
- HEATSINK CPU W/ADHESIVE .91SQ.
- Manufacturer's standard lead time:
- Sa stock
- Buhay sa istante:
- Isang taon
- Chip Mula:
- Hong Kong
- RoHS:
- Paraan ng Pagbayad:
-
- Paraan ng pagpapadala:
- Mga Kategorya ng Pamilya:
- Ang KEY Components Co, LTD ay isang Electronic Components Distributor na nag-aalok ng mga kategorya ng produkto kasama ang: Thermal - Thermoelectric, Peltier Modules, Thermal - Pagpili, Epoxies, Greases, Pastes, Thermal - Pagpili, Epoxies, Greases, Pastes, Mga Tagahanga ng DC, Thermal - Init na Pipa, Mga silid na singaw, Mga Tagahanga ng AC, Mga Tagahanga - Mga Kagamitan and Thermal - Mga Pads, Sheet ...
- Kumpetensyang Pakinabang:
- We specialize in CTS Thermal Management Products BDN09-3CB/A01 electronic components. BDN09-3CB/A01 can be shipped within 24 hours after order. If you have any demands for BDN09-3CB/A01, Please submit a Request for Quotation here or send us an email: rfq@key-components.com
BDN09-3CB/A01 Mga katangian ng produkto
Bilang ng Bahagi :
BDN09-3CB/A01
Tagagawa :
CTS Thermal Management Products
Paglalarawan :
HEATSINK CPU W/ADHESIVE .91SQ
Serye :
BDN
Katayuan ng Bahagi :
Active
Uri :
Top Mount
Pinalamig ang Pakete :
Assorted (BGA, LGA, CPU, ASIC...)
Paraan ng Lakip :
Thermal Tape, Adhesive (Included)
Hugis :
Square, Pin Fins
Haba :
0.910" (23.11mm)
Lapad :
0.910" (23.11mm)
Diameter :
-
Taas ng Base (Taas ng Fin) :
0.355" (9.02mm)
Power Dissipation @ temperatura ng Pagtaas :
-
Thermal Resistance @ Sapilitang Air Flow :
9.60°C/W @ 400 LFM
Thermal Resistance @ Likas :
26.90°C/W
Materyal :
Aluminum
Tapos na ang Materyal :
Black Anodized
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