TG6050-20-10-1 Pagpepresyo (USD) [110024pcs Stock]
- 1 pcs$0.33618
- 10 pcs$0.32075
- 25 pcs$0.30485
- 50 pcs$0.29678
- 100 pcs$0.29275
- 250 pcs$0.27271
- 500 pcs$0.25666
- 1,000 pcs$0.23260
- 5,000 pcs$0.22458
- Bilang ng Bahagi:
- TG6050-20-10-1
- Tagagawa:
- t-Global Technology
- Detalyadong Paglalarawan:
- THERM PAD 20MMX10MM RED.
- Manufacturer's standard lead time:
- Sa stock
- Buhay sa istante:
- Isang taon
- Chip Mula:
- Hong Kong
- RoHS:
- Paraan ng Pagbayad:
-
- Paraan ng pagpapadala:
- Mga Kategorya ng Pamilya:
- Ang KEY Components Co, LTD ay isang Electronic Components Distributor na nag-aalok ng mga kategorya ng produkto kasama ang: Thermal - Thermoelectric, Peltier Modules, Mga Tagahanga - Mga Kagamitan, Thermal - Sobrang init, Thermal - Init na Pipa, Mga silid na singaw, Thermal - Mga Kagamitan, Thermal - Mga Pads, Sheet, Mga Tagahanga - Mga Kagamitan - Fan Cords and Thermal - Thermoelectric, Peltier Assemblies ...
- Kumpetensyang Pakinabang:
- We specialize in t-Global Technology TG6050-20-10-1 electronic components. TG6050-20-10-1 can be shipped within 24 hours after order. If you have any demands for TG6050-20-10-1, Please submit a Request for Quotation here or send us an email: rfq@key-components.com
TG6050-20-10-1 Mga katangian ng produkto
Bilang ng Bahagi :
TG6050-20-10-1
Tagagawa :
t-Global Technology
Paglalarawan :
THERM PAD 20MMX10MM RED
Serye :
TG6050
Katayuan ng Bahagi :
Active
Paggamit :
-
Uri :
Conductive Pad, Sheet
Hugis :
Rectangular
Balangkas :
20.00mm x 10.00mm
Kapal :
0.0400" (1.016mm)
Materyal :
Silicone Elastomer
Malagkit :
Tacky - Both Sides
Pag-back, Carrier :
-
Kulay :
Red
Thermal Resistivity :
-
Pag-andar ng Thermal :
6.0 W/m-K
Pinakabagong Balita
Maaari ka ring Makisalamuha sa
-
PL-2-3-254
Wakefield-Vette
THERM PAD 25.4MMX25.4MM GREEN. Thermal Interface Products ulTIMiFlux Thermal Gap Filling Pad, 3 W/m K Silicone Gap Filler, 2.0mm Thickness, 25.4x25.4mm, Green
-
CD-02-05-C-18
Wakefield-Vette
THERM PAD 0.689 X 0.689. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, Chipset Pad 0.689 Inch x 0.689 Inch, No Hole
-
CD-02-05-220
Wakefield-Vette
THERM PAD 17.78MMX12.7MM ORANGE. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, TO-220 Pad, 0.003 Inch Thick
-
CD-02-05-220-N
Wakefield-Vette
THERM PAD TO-220 NO HOLE. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, TO-220 Pad, No Hole
-
CD-02-05-247-N
Wakefield-Vette
THERM PAD TO-247 NO HOLE. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, TO-247 Pad, No Hole
-
CD-02-05-025
Wakefield-Vette
THERM PAD 25.4MMX25.4MM ORANGE. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, 1 Inch x 1 Inch Square Pad, 0.003 Inch Thick
Mga Mainit na Bahagi
- A15896-17
- A14561-02
- GP3500ULM--0.125-12-0816
- A15896-11
- A15996-07
- A14565-01
- PC99-100-100-0.06-0
- T69-305-305-0.040
- T69-295-295-0.040-1A
- 5519S-2MIL
- A14696-05
- DC0040/10-PC99AL-0.1
- DC0036/04-PC99-0.06
- DC0039/01-PC99-0.06
- DC0038/07-PC99AL-0.1
- DC0038/04-PC99-0.06
- TG2030S-320-320-2.0-0
- TG4040S-150-150-3.0-0
- T68-2C-120-90-0.05
- PC99AL-100-100-0.1-0
- PC99-100-100-0.12-0
- DC0001/06-PC99-0.06
- PC94-150-150-0.25-0
- PC99AL-150-150-0.1-0
- GPVOU-0.125-01-0816
- GPVOU-0.040-01-0816
- A16365-08
- A16365-04
- A15641-08
- A16017-19
- EYG-A121803S
- 5519S 210 MM X 155 MM X 1.5 MM
- TP03
- EYG-M091210SS
- CPU 1.75X1.75
- A16365-20
- A10113-80
- SPK4-0.006-00-1212
- 5519S 210 MM X 155 MM X 0.5 MM
- Q3-0.005-00-11