CTS Thermal Management Products - BDN11-3CB/A01

KEY Part #: K6265518

BDN11-3CB/A01 Pagpepresyo (USD) [34131pcs Stock]

  • 1 pcs$1.24277
  • 10 pcs$1.21104
  • 25 pcs$1.17843
  • 50 pcs$1.05579
  • 100 pcs$0.99370
  • 250 pcs$0.93161
  • 500 pcs$0.90055
  • 1,000 pcs$0.80739
  • 5,000 pcs$0.79186

Bilang ng Bahagi:
BDN11-3CB/A01
Tagagawa:
CTS Thermal Management Products
Detalyadong Paglalarawan:
HEATSINK CPU W/ADHESIVE 1.11SQ.
Manufacturer's standard lead time:
Sa stock
Buhay sa istante:
Isang taon
Chip Mula:
Hong Kong
RoHS:
Paraan ng Pagbayad:
Paraan ng pagpapadala:
Mga Kategorya ng Pamilya:
Ang KEY Components Co, LTD ay isang Electronic Components Distributor na nag-aalok ng mga kategorya ng produkto kasama ang: Mga Tagahanga - Mga Kagamitan, Thermal - Thermoelectric, Peltier Assemblies, Thermal - Mga Kagamitan, Thermal - Thermoelectric, Peltier Modules, Thermal - Mga Pads, Sheet, Mga Tagahanga - Mga Kagamitan - Fan Cords, Mga Tagahanga ng AC and Thermal - Pagpapalamig ng Liquid ...
Kumpetensyang Pakinabang:
We specialize in CTS Thermal Management Products BDN11-3CB/A01 electronic components. BDN11-3CB/A01 can be shipped within 24 hours after order. If you have any demands for BDN11-3CB/A01, Please submit a Request for Quotation here or send us an email:
GB-T-27922
ISO-9001-2015
ISO-13485
ISO-14001
ISO-28000-2007
ISO-45001-2018

BDN11-3CB/A01 Mga katangian ng produkto

Bilang ng Bahagi : BDN11-3CB/A01
Tagagawa : CTS Thermal Management Products
Paglalarawan : HEATSINK CPU W/ADHESIVE 1.11SQ
Serye : BDN
Katayuan ng Bahagi : Active
Uri : Top Mount
Pinalamig ang Pakete : Assorted (BGA, LGA, CPU, ASIC...)
Paraan ng Lakip : Thermal Tape, Adhesive (Included)
Hugis : Square, Pin Fins
Haba : 1.110" (28.19mm)
Lapad : 1.110" (28.19mm)
Diameter : -
Taas ng Base (Taas ng Fin) : 0.355" (9.02mm)
Power Dissipation @ temperatura ng Pagtaas : -
Thermal Resistance @ Sapilitang Air Flow : 7.20°C/W @ 400 LFM
Thermal Resistance @ Likas : 20.90°C/W
Materyal : Aluminum
Tapos na ang Materyal : Black Anodized

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