Bilang ng Bahagi :
APF30-30-06CB
Tagagawa :
CTS Thermal Management Products
Paglalarawan :
HEATSINK LOW-PROFILE FORGED
Katayuan ng Bahagi :
Active
Pinalamig ang Pakete :
Assorted (BGA, LGA, CPU, ASIC...)
Paraan ng Lakip :
Thermal Tape, Adhesive (Not Included)
Taas ng Base (Taas ng Fin) :
0.250" (6.35mm)
Power Dissipation @ temperatura ng Pagtaas :
-
Thermal Resistance @ Sapilitang Air Flow :
4.40°C/W @ 200 LFM
Thermal Resistance @ Likas :
-
Tapos na ang Materyal :
Black Anodized