CTS Thermal Management Products - BDN09-3CB

KEY Part #: K6265475

BDN09-3CB Pagpepresyo (USD) [48708pcs Stock]

  • 1 pcs$0.71077
  • 10 pcs$0.67523
  • 25 pcs$0.65742
  • 50 pcs$0.63969
  • 100 pcs$0.60415
  • 250 pcs$0.56862
  • 500 pcs$0.53308
  • 1,000 pcs$0.49754
  • 5,000 pcs$0.47977

Bilang ng Bahagi:
BDN09-3CB
Tagagawa:
CTS Thermal Management Products
Detalyadong Paglalarawan:
HEATSINK CPU .91 SQ.
Manufacturer's standard lead time:
Sa stock
Buhay sa istante:
Isang taon
Chip Mula:
Hong Kong
RoHS:
Paraan ng Pagbayad:
Paraan ng pagpapadala:
Mga Kategorya ng Pamilya:
Ang KEY Components Co, LTD ay isang Electronic Components Distributor na nag-aalok ng mga kategorya ng produkto kasama ang: Thermal - Thermoelectric, Peltier Assemblies, Mga Tagahanga ng DC, Thermal - Mga Pads, Sheet, Thermal - Mga Kagamitan, Thermal - Pagpapalamig ng Liquid, Thermal - Init na Pipa, Mga silid na singaw, Mga Tagahanga ng AC and Thermal - Thermoelectric, Peltier Modules ...
Kumpetensyang Pakinabang:
We specialize in CTS Thermal Management Products BDN09-3CB electronic components. BDN09-3CB can be shipped within 24 hours after order. If you have any demands for BDN09-3CB, Please submit a Request for Quotation here or send us an email:
GB-T-27922
ISO-9001-2015
ISO-13485
ISO-14001
ISO-28000-2007
ISO-45001-2018

BDN09-3CB Mga katangian ng produkto

Bilang ng Bahagi : BDN09-3CB
Tagagawa : CTS Thermal Management Products
Paglalarawan : HEATSINK CPU .91 SQ
Serye : BDN
Katayuan ng Bahagi : Active
Uri : Top Mount
Pinalamig ang Pakete : Assorted (BGA, LGA, CPU, ASIC...)
Paraan ng Lakip : Thermal Tape, Adhesive (Not Included)
Hugis : Square, Pin Fins
Haba : 0.910" (23.11mm)
Lapad : 0.910" (23.11mm)
Diameter : -
Taas ng Base (Taas ng Fin) : 0.355" (9.02mm)
Power Dissipation @ temperatura ng Pagtaas : -
Thermal Resistance @ Sapilitang Air Flow : 9.60°C/W @ 400 LFM
Thermal Resistance @ Likas : 26.90°C/W
Materyal : Aluminum
Tapos na ang Materyal : Black Anodized

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