Advanced Thermal Solutions Inc. - ATS-H1-39-C2-R0

KEY Part #: K6264053

ATS-H1-39-C2-R0 Pagpepresyo (USD) [5877pcs Stock]

  • 1 pcs$6.57965
  • 10 pcs$6.21255
  • 25 pcs$5.84686
  • 50 pcs$5.48151
  • 100 pcs$5.11604
  • 250 pcs$4.75062
  • 500 pcs$4.65927

Bilang ng Bahagi:
ATS-H1-39-C2-R0
Tagagawa:
Advanced Thermal Solutions Inc.
Detalyadong Paglalarawan:
HEATSINK 57.9X60.96X5.84MM T766.
Manufacturer's standard lead time:
Sa stock
Buhay sa istante:
Isang taon
Chip Mula:
Hong Kong
RoHS:
Paraan ng Pagbayad:
Paraan ng pagpapadala:
Mga Kategorya ng Pamilya:
Ang KEY Components Co, LTD ay isang Electronic Components Distributor na nag-aalok ng mga kategorya ng produkto kasama ang: Thermal - Mga Pads, Sheet, Thermal - Sobrang init, Thermal - Pagpili, Epoxies, Greases, Pastes, Mga Tagahanga - Mga Kagamitan - Fan Cords, Thermal - Pagpapalamig ng Liquid, Mga Tagahanga - Mga Kagamitan, Thermal - Init na Pipa, Mga silid na singaw and Thermal - Mga Kagamitan ...
Kumpetensyang Pakinabang:
We specialize in Advanced Thermal Solutions Inc. ATS-H1-39-C2-R0 electronic components. ATS-H1-39-C2-R0 can be shipped within 24 hours after order. If you have any demands for ATS-H1-39-C2-R0, Please submit a Request for Quotation here or send us an email:
GB-T-27922
ISO-9001-2015
ISO-13485
ISO-14001
ISO-28000-2007
ISO-45001-2018

ATS-H1-39-C2-R0 Mga katangian ng produkto

Bilang ng Bahagi : ATS-H1-39-C2-R0
Tagagawa : Advanced Thermal Solutions Inc.
Paglalarawan : HEATSINK 57.9X60.96X5.84MM T766
Serye : pushPIN™
Katayuan ng Bahagi : Active
Uri : Top Mount
Pinalamig ang Pakete : Assorted (BGA, LGA, CPU, ASIC...)
Paraan ng Lakip : Push Pin
Hugis : Rectangular, Fins
Haba : 2.280" (57.90mm)
Lapad : 2.400" (60.96mm)
Diameter : -
Taas ng Base (Taas ng Fin) : 0.230" (5.84mm)
Power Dissipation @ temperatura ng Pagtaas : -
Thermal Resistance @ Sapilitang Air Flow : 18.94°C/W @ 100 LFM
Thermal Resistance @ Likas : -
Materyal : Aluminum
Tapos na ang Materyal : Blue Anodized

Maaari ka ring Makisalamuha sa
  • 396-2AB

    Wakefield-Vette

    HEATSINK 5.5X5X1.38 POWER/IGBT. Heat Sinks Performance, Low Profile Heatsink for Power Modules & IGBTs, 139.7x35.1x127mm, 6 Mounting Holes

  • 122259

    Wakefield-Vette

    HEATSINK 16639 PROFILE 12. Heat Sinks 16639 Extrusion Profile Cut to 12 Inches, 12x7.9x1.31 Inch, High Aspect Ratio

  • TG-CJ-LI-32-32-6-PF

    t-Global Technology

    HEATSINK CER 32X32X6MM W/TAPE.

  • PH3N-50.8-12.7-0.07-1A

    t-Global Technology

    PH3N NANO 50.8X12.07X0.07MM.

  • TG-CJ-43-43-6-PF

    t-Global Technology

    HEATSINK CER 43X43X6MM.

  • AH50600V05000EE

    Ohmite

    ALUMINUM EXTRUSION 5. Heat Sinks Alum Extrusion 5" For HS75 Series