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  1. Bahay
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  5. 6030D(COPPER)G

Aavid, Thermal Division of Boyd Corporation - 6030D(COPPER)G

KEY Part #: K6265588

6030D(COPPER)G Pagpepresyo (USD) [76032pcs Stock]

  • 1 pcs$0.52262
  • 10 pcs$0.49712
  • 25 pcs$0.48416
  • 50 pcs$0.47112
  • 100 pcs$0.44490
  • 250 pcs$0.41874
  • 500 pcs$0.39256
  • 1,000 pcs$0.34659
  • 5,000 pcs$0.33421
Bilang ng Bahagi:
6030D(COPPER)G
Tagagawa:
Aavid, Thermal Division of Boyd Corporation
Detalyadong Paglalarawan:
BOARD LEVEL HEAT SINK. Heat Sinks Board Level Stamped Heatsink for TO-220, Vertical Mounting, 12.5 Degree C/W Thermal Resistance
Manufacturer's standard lead time:
Sa stock
Buhay sa istante:
Isang taon
Chip Mula:
Hong Kong
RoHS:
Paraan ng Pagbayad:
Paraan ng pagpapadala:
Mga Kategorya ng Pamilya:
Ang KEY Components Co, LTD ay isang Electronic Components Distributor na nag-aalok ng mga kategorya ng produkto kasama ang: Thermal - Pagpili, Epoxies, Greases, Pastes, Thermal - Sobrang init, Thermal - Thermoelectric, Peltier Assemblies, Thermal - Pagpapalamig ng Liquid, Thermal - Init na Pipa, Mga silid na singaw, Mga Tagahanga ng AC, Thermal - Mga Pads, Sheet and Mga Tagahanga - Mga Kagamitan - Fan Cords ...
Kumpetensyang Pakinabang:
We specialize in Aavid, Thermal Division of Boyd Corporation 6030D(COPPER)G electronic components. 6030D(COPPER)G can be shipped within 24 hours after order. If you have any demands for 6030D(COPPER)G, Please submit a Request for Quotation here or send us an email:
GB-T-27922
ISO-9001-2015
ISO-13485
ISO-14001
ISO-28000-2007
ISO-45001-2018

6030D(COPPER)G Mga katangian ng produkto

Bilang ng Bahagi : 6030D(COPPER)G
Tagagawa : Aavid, Thermal Division of Boyd Corporation
Paglalarawan : BOARD LEVEL HEAT SINK
Serye : -
Katayuan ng Bahagi : Active
Uri : Board Level, Vertical
Pinalamig ang Pakete : TO-220
Paraan ng Lakip : Bolt On and PC Pin
Hugis : Rectangular, Fins
Haba : 1.180" (29.97mm)
Lapad : 1.000" (25.40mm)
Diameter : -
Taas ng Base (Taas ng Fin) : 0.500" (12.70mm)
Power Dissipation @ temperatura ng Pagtaas : 1.0W @ 20°C
Thermal Resistance @ Sapilitang Air Flow : 6.00°C/W @ 300 LFM
Thermal Resistance @ Likas : 12.50°C/W
Materyal : Copper
Tapos na ang Materyal : Tin

Pinakabagong Balita

Aavid, Thermal Division of Boyd Corporation Hi-Contact™ Liquid Cold Plates
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