Bilang ng Bahagi :
BDN16-3CB/A01
Tagagawa :
CTS Thermal Management Products
Paglalarawan :
HEATSINK CPU W/ADHESIVE 1.61SQ
Katayuan ng Bahagi :
Active
Pinalamig ang Pakete :
Assorted (BGA, LGA, CPU, ASIC...)
Paraan ng Lakip :
Thermal Tape, Adhesive (Included)
Taas ng Base (Taas ng Fin) :
0.355" (9.02mm)
Power Dissipation @ temperatura ng Pagtaas :
-
Thermal Resistance @ Sapilitang Air Flow :
4.50°C/W @ 400 LFM
Thermal Resistance @ Likas :
13.50°C/W
Tapos na ang Materyal :
Black Anodized