Laird Technologies - Thermal Materials - A15427-005

KEY Part #: K6153180

A15427-005 Pagpepresyo (USD) [173187pcs Stock]

  • 1 pcs$0.21357
  • 10 pcs$0.20408
  • 25 pcs$0.19395
  • 50 pcs$0.18881
  • 100 pcs$0.18624
  • 250 pcs$0.17347
  • 500 pcs$0.16326
  • 1,000 pcs$0.14796
  • 5,000 pcs$0.14285

Bilang ng Bahagi:
A15427-005
Tagagawa:
Laird Technologies - Thermal Materials
Detalyadong Paglalarawan:
THERM PAD 19.05MMX12.7MM AMBER.
Manufacturer's standard lead time:
Sa stock
Buhay sa istante:
Isang taon
Chip Mula:
Hong Kong
RoHS:
Paraan ng Pagbayad:
Paraan ng pagpapadala:
Mga Kategorya ng Pamilya:
Ang KEY Components Co, LTD ay isang Electronic Components Distributor na nag-aalok ng mga kategorya ng produkto kasama ang: Thermal - Pagpili, Epoxies, Greases, Pastes, Thermal - Mga Pads, Sheet, Thermal - Thermoelectric, Peltier Modules, Thermal - Thermoelectric, Peltier Assemblies, Thermal - Mga Kagamitan, Mga Tagahanga - Mga Kagamitan - Fan Cords, Thermal - Pagpili, Epoxies, Greases, Pastes and Thermal - Pagpapalamig ng Liquid ...
Kumpetensyang Pakinabang:
We specialize in Laird Technologies - Thermal Materials A15427-005 electronic components. A15427-005 can be shipped within 24 hours after order. If you have any demands for A15427-005, Please submit a Request for Quotation here or send us an email:
GB-T-27922
ISO-9001-2015
ISO-13485
ISO-14001
ISO-28000-2007
ISO-45001-2018

A15427-005 Mga katangian ng produkto

Bilang ng Bahagi : A15427-005
Tagagawa : Laird Technologies - Thermal Materials
Paglalarawan : THERM PAD 19.05MMX12.7MM AMBER
Serye : Tgard™ K52
Katayuan ng Bahagi : Active
Paggamit : TO-220
Uri : Insulator Pad, Sheet
Hugis : Rectangular
Balangkas : 19.05mm x 12.70mm
Kapal : 0.0030" (0.076mm)
Materyal : Polyimide, Ceramic Filled
Malagkit : -
Pag-back, Carrier : -
Kulay : Amber
Thermal Resistivity : -
Pag-andar ng Thermal : -

Maaari ka ring Makisalamuha sa
  • PL-2-1-254

    Wakefield-Vette

    THERM PAD 25.4MMX25.4MM GRAY. Thermal Interface Products ulTIMiFlux Thermal Gap Filling Pad, 1 W/m K Silicone Gap Filler, 2.0mm Thickness, 25.4x25.4mm, Grey

  • CD-02-05-C-18

    Wakefield-Vette

    THERM PAD 0.689 X 0.689. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, Chipset Pad 0.689 Inch x 0.689 Inch, No Hole

  • CD-02-05-126

    Wakefield-Vette

    THERM PAD TO-126 PAD WITH HOLE. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, TO-126 Pad with Hole

  • CD-02-05-C-20

    Wakefield-Vette

    THERM PAD 0.768 X 0.768. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, Chipset Pad 0.768 Inch x 0.768 Inch, No Hole

  • CD-02-05-REC-125-N

    Wakefield-Vette

    THERM PAD RECT 1.25 X 1.25. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, Rectifier Pad 1.25 Inch x 1.25 Inch, No Hole

  • PL-2-5-254-H

    Wakefield-Vette

    THERM PAD 25.4MMX25.4MM GOLD. Thermal Interface Products ulTIMiFlux Thermal Gap Filling Pad, 5 W/m K Silicone Gap Filler, 2.0mm Thickness, 25.4x25.4mm, Gold, Hyper Soft